Micropackaging

Within STFC significant expertise has been developed in the assembly of high resolution silicon detectors covering large areas. These have been developed for large detector projects at CERN.

These large instruments built for particle physics required technologies developing for high density interconnect which have now found use in other instrumentation applications. High density wire bonding for small volume production is available within STFC with wide experience in the assembly of both silicon and other semiconductor materials based detectors. Wire bond  encapsulation has also been developed for several applications.  Low force, high frequency wire bonding has been developed to give minimum damage to bond pads. Experience in  interconnecting of dissimilar materials through glue based interconnect both in one dimension and two dimensions has been developed.  Precision assembly using flip chip techniques and bump bonding is being developed for future projects and metrology both over large area and small areas is well developed.